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High Performance Butterfly Packaged Laser Diode Mount & Heat Sink Assembly; Advanced Thermal Design Dissipates up to 50 Watts of Heat

  • butterfly laser diode mounting socket
  • Thermal performance of high power laser diode heat sink
  • laser diode heat sink dimensions

sku / item#: SBC-050A / LASER-DIODE-HEAT-SINK
ships: 3 to 5 days

Key Features
  • Universal 14-Pin Butterfly Laser Diode Mounting Socket (works with all butterfly packages)
  • User Upgradeable to 2 x BA-02 Universal Butterfly Laser Diode Mount
  • Includes Case Temperature Control TEC / Peltier Cooler Under Laser Diode Mounting Plate

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Why do Scientists & Engineers Choose Laser Lab Source?

PRICE $499.00
  • Works with All 14-Pin and 10-Pin Butterfly Packaged Laser Diodes
  • Butterfly Package Mounting Plate Thermal Resistance: TEC to Ambient 0.22ºC/W
  • Typical Temperature Uniformity: <0.5ºC Across Mounting Plate
  • Integrated Case Temperature Control TEC Max Rating: 150ºC
  • Heat Load (Qmax) Maximum: 50 Watts
  • Anodized Aluminum Mounting Plate
Butterfly Laser Diode Mounting Socket
  • Laser Package Pin Connections Fully Configurable for Any Pin-Out
  • Zero-Insertion Force Socket, No Soldering Required
  • Plastic Clamp Ensures Positive Thermal Contact to Cooling Plate
  • For Optimum Temperature Accuracy, the Butterfly Package Sits Directly over the Thermistor Installed in the Cold Plate
  • Fan/TEC Connection: 6 Pin Screw Terminal Block
  • Connections: TEC x 2, Fan x 1
  • On-Board Butterfly Connector: SAMTEC IPL-1-110-02-S-D;
    Mating Connector SAMTEC IPD1-10-D-K
  • TEC Ratings (max): 4.2 Amps, 24 Volts Per TEC
  • Fan Rated Voltage: 12 VDC
  • Fan Operating Voltage Range: 5.5-13.8 VDC
  • Fan Rated Current: 1.6 A
  • Fan Input Power: 9.9 W

Product Overview:

50W Fan Cooled Laser Diode Heat Sink
with Butterfly Laser Diode Mounting Socket

This versatile laser diode thermoelectric heat sink and cooling module has been optimized for high power butterfly packages, and includes the BA-02 universal butterfly laser diode mounting socket. Embedded high efficiency TEC's and a fan provide high temperature stability and precise temperature control. The standard air flow direction is pushing air thru the heat sink; the fan is configurable to allow a user to remove the fan and change the direction of the air flow as desired. This allows the user to optimize the performance for the ambient air flow conditions in the lab.

Cold Plate pre-Drilled for the Universal Butterfly Laser Diode Mount Integration

The mounting plate is pre-drilled to match the included BA-02 Universal Butterfly Laser Diode Mount . The SBC-050A includes a single BA-02, and a second BA-02 or BA-01 can easily be mounted to the cold plate at a later time. The BA-02 mount offers complete pin-configuration flexibility, zero-insertion force connections, and solid thermal interface to the mounting plate; the BA-01 is pre-wired for high power pump laser diodes.

Heat Sink Cooling Design Details

The mounting base for the laser diode is temperature controlled by Peltier / TEC coolers. The thermistor for temperature regulation is embedded in the aluminum cold-plate directly beneath the butterfly laser mount located near the fan. The maximum operating current for the TE cooler is 4.2 amp with a maximum voltage of 24 volts DC at room temperature (the current and voltage required for the TE cooler will increases as the ambient temperature increases in the lab). The user should not exceed the maximum specified current. Exceeding the maximum power ratings will reduce the performance of the TE cooler and reduce its reliability.

Tuning the TEC Drive Current

Users are advised to manually adjust the current to the TEC after attaching the diode to the top plate. This will allow the user to identify the optimum current and set the current limit on the TEC controller appropriately. All of the Peltier modules used are environmentally sealed to allow operation below dew points. The cold plate is made of anodized aluminum alloy.

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