$360.00 sku / item#: RLS/OCP-050A ships: 1 to 3 days
- Up to 50 Watts of Laser Waste Heat Removal Capacity
- Optimized for 808nm, 915nm, 940nm, 980nm and 14-Pin Butterfly Packaged Laser Diodes
- Pre-Drilled Mounting Plates for Butterfly Packages as well as High Power 10W to 35W Pumps from Lumentum, nLIGHT, Coherent, Lumics, II-VI, DILAS and Jenoptik
- Thermal Resistance ~ TEC to Ambient 0.22ºC/W
- Custom Mounting Plates Available on Request
- Offered by ETE, a Laser Lab Source Marketplace Seller
Sold & Supported in North America by: LaserDiodeControl.com, part of the Laser Lab Source Marketplace Group
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|INTEGRATED FAN AND TEC RATINGS|
50W Advanced Performance Peltier &d Fan Cooled Laser Diode Heat Sink
This versatile laser diode thermoelectric heat sink and cooling module has been optimized for high power CS / CCP Bar Mounts, butterfly packages, and 2-Pin 915nm, 940nm, 980nm fiber coupled laser diode pumps. Embedded high efficiency TEC's and a fan provide high temperature stability and precise temperature control. The standard air flow direction is pushing air thru the heat sink; An option is available to pull air from the front of the heatsink (OCP-050A-P) for free-space CS bar style diodes. The fan is configurable to allow a user to remove the fan and change the direction of the air flow as desired. This allows the user to optimize the performance for the ambient air flow conditions in the lab.
Heat Sink Cooling Design Details
The mounting base for the laser diode is temperature controlled by peltier / TEC coolers. The maximum operating current for the TE cooler is 4.2 amp with a maximum voltage draw of 24 volts DC at room temperature. The current and voltage required for the TE cooler will increases as the temperature of the lab increases. The user should not exceed the maximum specified current. Exceeding the maximum power ratings will reduce the performance of the TE cooler and reduce its reliability. The typical current required for each of the TEC's is in the 3 to 4 amp range. This will vary due to the desired temperature set point and the heat load.
Laser Diode Heat Sink can be Pre-Configured for Universal Butterfly Laser Diode Mount Integration
The mounting plate is pre-drilled to match the LDM-BUTTERFLY series Universal Butterfly Laser Diode Mounting Kit. These mounts offer complete pin-configuration flexibility, zero-insertion force connections, and solid thermal interface to the mounting plate. Up to two BA-Series mounts can be attached to the mounting plate.
The interface quality between the laser diode and the heat sink also contributes highly to the performance of the unit. For high power laser modules with large footprints, it is very difficult to maintain uniform high quality interface, and it is recommended to use a thermal compound or a phase change material to facilitate the heat dissipation through the laser package into the heat sink.
Users are advised to manually adjust the current to the TEC after attaching the diode to the top plate. This will allow the user to identify the optimum current and set the current limit on the TEC controller appropriately. All of the peltier modules used are environmentally sealed to allow operation below dew points. The cold plate is made of anodized aluminum alloy. (All the higher power cold plates offered by ETE are made of copper to better spread the highly concentrated heat).
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