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Advanced Thermal Design Dissipates up to 150 Watts of Heat; High Performance LASER DIODE Mount & Heat Sink Assembly

  • 150 Watt Air Cooled Heatsink HS008
  • Laser Diode Heatsink Peltier Dimensions
  • Fan Cooled 150 Watt Heatsink Features

sku / item#: HS-008 / LASER-DIODE-HEAT-SINK
ships: 3 to 5 days

Key Features
  • Low Thermal Resistance: 0.08 ºC/W
  • Suitable for up to 150 W Heat Load
  • Affordable Laser Diode Heat-Sink Assembly
  • Highly Versatile Forced-Air Heat-Sink
  • Soldered-In Heatpipes for Maximum Efficiency
  • Nickel Plated Mounting Surface for Durability
  • Two Fans, Each 12 VDC, 9.9 Watt

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Why do Scientists & Engineers Choose Laser Lab Source?

PRICE $359.00
  • Thermal Resistance: 0.08 ºC/W
  • Heat Dissipation Capacity: 150 W with 12 ºC Temperature Rise
  • Dimensions (L x W x H): 215 mm x 184 mm x 97 mm
  • Fan Voltage: 5.5 ~ 13.8 VDC
  • Fan Input Power: 2x 9.9 Watts
  • Fan Noise Level: 47 dBA
  • Refer to datasheet for additional specifications

Product Overview:

High Efficiency Laser Diode Heatpipe-Heatsink-Fan Assembly

The HS-008 is an affordable, high quality, versatile integrated heatsink and fan assembly, designed for maximum flexibility across a wide range of applications in your laser diode test lab and prototype shop. The mounting plate is nickel-plated for durability and improved heat conduction. Heatpipes are soldered into the nickel-plated mounting plate to minimize thermal spreading resistance, distribute the heat across the heatsink, and minimize efficiency-robbing thermal hot spots. To protect the surface until you're ready to use it, the mount ships with a protective film over the mounting plate.

The HS-008 is a very affordable solution for a wide range of situations where a fully integrated thermoelectric cooled mount is overkill or over-budget. The HS-008 is perfect when high amounts of heat must be conducted away from the test device, but precision temperature control of the device is not required. The HS-008 provides laser heat dissipation capacity of 150 watts with 12 ºC temperature rise (12 ºC without TECs, 0 ºC rise with optimized TECs).

The HS-008 heatsink is ideal for a wide variety of fiber-coupled laser packages and modules, IGBTs, high-heat test loads, and the like.

Low Thermal Resistance for High Heat-Flux Diode Laser Devices

Heatpipes are used in the HS-008 to maximize conduction of heat from the load to the heatsink and improve overall efficiency by reducing local hot-spots on the mounting plate. The fins on the heatsink are designed to break up laminar airflow, which improves heat dissipation efficiency, as well. Finally, the high fin-density heatsink is enclosed in a sheet metal duct to direct the entire volume of forced air over the fins, thereby providing the low thermal resistance of 0.08 ºC/W. This low thermal resistance means that for every 10 Watts of power input to the heat-sink mounting plate, the temperature of the heatsink surface will rise 0.8 ºC.

Customizable Options for Maximum Versatility and Ease-of-Use

All heatsink modules can be ordered with an optional IP68 fan for operating in harsh dust and liquid environments. Also, custom mounting pre-drilled hole patterns are available from the manufacturer. Contact us for details and a quote.

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