Advanced Thermal Design Dissipates up to 150 Watts of Heat; High Performance LASER DIODE Mount & Heat Sink Assembly
$359.00 sku / item#: HS-008 / LASER-DIODE-HEAT-SINK ships: 3 to 5 days
- Low Thermal Resistance: 0.08 ºC/W
- Suitable for up to 150 W Heat Load
- Affordable Laser Diode Heat-Sink Assembly
- Highly Versatile Forced-Air Heat-Sink
- Soldered-In Heatpipes for Maximum Efficiency
- Nickel Plated Mounting Surface for Durability
- Two Fans, Each 12 VDC, 9.9 Watt
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|MODEL||HS-008 / LASER-DIODE-HEAT-SINK|
High Efficiency Laser Diode Heatpipe-Heatsink-Fan Assembly
The HS-008 is an affordable, high quality, versatile integrated heatsink and fan assembly, designed for maximum flexibility across a wide range of applications in your laser diode test lab and prototype shop. The mounting plate is nickel-plated for durability and improved heat conduction. Heatpipes are soldered into the nickel-plated mounting plate to minimize thermal spreading resistance, distribute the heat across the heatsink, and minimize efficiency-robbing thermal hot spots. To protect the surface until you're ready to use it, the mount ships with a protective film over the mounting plate.
The HS-008 is a very affordable solution for a wide range of situations where a fully integrated thermoelectric cooled mount is overkill or over-budget. The HS-008 is perfect when high amounts of heat must be conducted away from the test device, but precision temperature control of the device is not required. The HS-008 provides laser heat dissipation capacity of 150 watts with 12 ºC temperature rise (12 ºC without TECs, 0 ºC rise with optimized TECs).
The HS-008 heatsink is ideal for a wide variety of fiber-coupled laser packages and modules, IGBTs, high-heat test loads, and the like.
Low Thermal Resistance for High Heat-Flux Diode Laser Devices
Heatpipes are used in the HS-008 to maximize conduction of heat from the load to the heatsink and improve overall efficiency by reducing local hot-spots on the mounting plate. The fins on the heatsink are designed to break up laminar airflow, which improves heat dissipation efficiency, as well. Finally, the high fin-density heatsink is enclosed in a sheet metal duct to direct the entire volume of forced air over the fins, thereby providing the low thermal resistance of 0.08 ºC/W. This low thermal resistance means that for every 10 Watts of power input to the heat-sink mounting plate, the temperature of the heatsink surface will rise 0.8 ºC.
Customizable Options for Maximum Versatility and Ease-of-Use
All heatsink modules can be ordered with an optional IP68 fan for operating in harsh dust and liquid environments. Also, custom mounting pre-drilled hole patterns are available from the manufacturer. Contact us for details and a quote.
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