Home > Laser Diode Heat Sinks & Mounts > ETE > OPC-150 / LASER-DIODE-HEAT-SINK
Advanced Thermal Design Dissipates up to 150 Watts of Heat; High Performance LASER DIODE Mount & Heat Sink Assembly
$769.00 sku / item#: OPC-150 / LASER-DIODE-HEAT-SINK ships: 3 to 5 days
- Flexible High Power Laser Diode Heat Sink
- 150 Watt Heat Load Capacity @ 25ºC Ambient
- Integrated TECs and 2x High CFM Fans
- Predrilled Mounting Patterns for Lasers from: QPC, nLight and LIMO, Jenoptik, and Coherent
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|MODEL||OPC-150 / LASER-DIODE-HEAT-SINK|
|INTEGRATED FAN AND TEC RATINGS|
High Power Laser Diode Thermoelectric Cold Plate Assembly
The OCP-150 is a high quality and versatile integrated thermoelectric cold plate module, designed for maximum flexibility across a wide range of applications in your laser diode test lab and prototype shop. The mounting plate is nickel-plated copper for improved heat conduction and durability. The thermoelectric coolers beneath the mounting plate are attached to our HS-008 heatsink assembly, which has six soldered-in heatpipes to improve heat dissipation efficiency.
The OCP-150 is an affordable solution for a wide range of situations where a fully integrated thermoelectric cooled mount is needed for precision temperature control. The OCP-150 will dissipate up to 150 Watts with 0 ºC temperature rise. The OCP-150 has standard mounting patterns for the many of the most popular fiber coupled high power laser diodes from QPC (Brightlase and Ultra), nLight (Pearl), LIMO, Jenoptik (JOLD), and Coherent. Custom mounting hole patterns are available upon request.
The OCP-150 comes with a high quality terminal block for fan wiring. The two high power fans are hidden inside the air duct, reducing the noise significantly.
Low Thermal Resistance for High Heat-Flux Diode Laser Devices
The OCP-150 features sealed high quality thermoelectric coolers sandwiched between the mounting plate and the heatsink base plate. Heatpipes are used in the base plate of the OCP-150 to maximize conduction of heat from the thermoelectric coolers to the heatsink and improve overall efficiency by reducing local hot-spots.
The heatsink fins are forged in place and are designed to break up laminar airflow, which further improves heat dissipation efficiency. Finally, the high fin-density heatsink is enclosed in a sheet metal duct to direct the entire volume of forced air over the fins, thereby reducing the low thermal resistance.
Customizable Options for Maximum Versatility and Ease-of-Use
The OCP-150 can be ordered with custom mounting hole configurations; contact us for details.
All heatsink modules can be ordered with an optional IP68 fan for operating in harsh dust and liquid environments. Also, custom mounting pre-drilled hole patterns are available. Contact us for details and a quote.
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