OCP-150 High Power Thermoelectric Laser Diode Mount, for 150 Watt lasers

  • 150 Watt Laser diode heatsink

$650.00   Ships: 1 Week ARO | Model

Key Features
  • Flexible High Power Laser Diode Heat Sink
  • 2 Integrated TEC's and Fans for Heat Removal
  • 150 Watts of Heat Removal

Price and Delivery Quote

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MODEL
PRICE $650.00
OVERVIEW
  • Laser Mounting Plate Footprint: Customer specified at time of
  • order
  • Mounting Plates Available: LIMO, QPC, nLIGHT, DILAS, Lasertel, Jenoptik, JDSU, COHERENT, NG-CEO, Quantel (model specific)
  • Custom Mounting Plates: Available (request information)
  • Thermal Resistance: TEC to Ambient 0.08ºC
  • Typical Temperature Uniformity: <0.5ºC Across Mounting Plate
  • TEC Max Rating: 150ºCHeat Load Maximum: 150 WattsCooling Plate Material: Nickel Plated Copper
INTERFACE CONNECTORS
  • Type: 6 Pin Terminal Block
  • Connections: TEC x 2, Fan x 1
INTEGRATED FAN AND TEC RATINGS
  • TEC Ratings (max): 4.2 Amps, 36 Volts Per TEC
  • Fan Rated Voltage: 12VDC
  • Fan Operating Voltage Range: 5.5-13.8 VDC
  • Fan Rated Current: 1.6A
  • Fan Input Power : 9.9W

Product Overview:

The Model OCP-150 high power laser diode heat sink is a high performance thermoelectric cooling module designed for high power laser diode modules and other mounted laser devices. These heat sinks from Elite Thermal Engineering offer an affordable and convenient high performance solution for general cooling of fiber coupled lasers in laboratory environments. They offer a highly uniform flatness and finish to the laser mounting plate to maximize the heat dissipation and protect the high power diode laser being tested.
The OCP-150 has standard mounting patterns for the many of the most popular fiber coupled high power laser diodes from QPC (Brightlase and Ultra), nLight (Pearl), LIMO, Jenoptik (JOLD), and Coherent. Custom mounting hole patterns are available upon request.
The heatsink has three heat pipes embedded into the base of the heatsink to minimize thermal resistance. The heat pipes and heatsink are nickel plated and soldered together to ensure low thermal impedance. High reliability TEC elements are installed under the cooling plate to provide fast heat removal and stable temperature control. All electrical connections are provided through a terminal block.

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