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Advanced Thermal Design Dissipates up to 300 Watts of Heat; High Performance LASER DIODE Mount & Heat Sink Assembly

  • Laser Diode Heat Sink Main Product Image
  • Laser Diode Heat Sink, High Power 300W Model
  • heat sink for laser diodes, side view
  • High Power Heatsink for Laser Diodes 300 Watt

$749.00  
sku / item#: HS-004 / LASER-DIODE-HEAT-SINK
ships: 3 to 5 days

Key Features
  • Designed to Heat Sink High Power 808 / 915 / 940 / 980 nm Fiber-Coupled Pumps
  • Embedded Heatpipes Minimize Thermal Hot Spots and Disseminate Heat Load Across the Surface to Maximize Efficiency
  • Nickel Plated Laser Diode Module Mounting Surface for Durability and Low Thermal Resistance
  • Heat Sink Fins Forged into Place to Maximize the Break-Up of Laminar Airflow, Fins Enclosed in a Duct to Direct to Force Waste Heat Uniformly Across and Out of Assembly
  • Offered by ETE, a Laser Lab Source Marketplace Seller
  • Sold & Supported in North America by: LaserDiodeControl.com, part of the
    Laser Lab Source Marketplace Group

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MODEL HS-004 / LASER-DIODE-HEAT-SINK
PRICE $749.00
high power fiber-coupled laser diode HEAT SINK ASSEMBLY SPECIFICATIONS
  • Low Thermal Resistance: 0.04 ºC/W
  • Heat Dissipation Capacity: 300 Watts
  • Embedded Copper Heatpipes: 4 x Soldered-In Copper Pipes for Heat Spreading
  • Fans: 5 x High CFM Fans for Waste Heat Removal
  • Fan Operating Voltage Range: 7 VDC to 13.8 VDC
  • Fan Input Power (5 fans total): 50 Watts
  • Fan Rated Current Draw (for all 5 fans): 4.2A (5.2A startup)
  • Fan Noise: < 50 dBA
  • Fan Rated Voltage: 12 VDC Input
  • Heat Sink Assembly Dimensions (L x W x H): 215 mm x 343.6 mm x 97 mm

Product Overview:

EMBEDDED COPPER HEAT-DISSIPATION TUBES AND NICKEL PLATED ALUMINUM MOUNTING SURFACE

The elite thermal engineering HS-004 is a high quality laser diode heat sink assembly designed for maximum flexibility across a wide range of applications. The mounting plate is nickel-plated for durability and improved heat conduction. Copper heat-dissipate tubes are soldered into the nickel-plated mounting plate to minimize thermal resistance and distribute the heat across the heatsink. The heat-dissipate tubes also minimize thermal hot spots and disseminate the heat load across the surface to increase efficiency. This unit is an excellent heat sink choice when high amounts of heat must be conducted away from the test device, but when precision (TEC based) temperature control of the device is not required. It provides laser heat dissipation capacity of up to 300 watts with an absolute maximum of 12ºC temperature rise under full load.

LOW THERMAL IMPEDANCE DESIGN FOR HIGH POWER LASER DIODE MODULES

Heat-dissipation tubes are used in to maximize the conduction of heat from the load to the heat sink and improve overall efficiency by reducing localized hot-spots on the mounting plate. The heat sink fins are forged in place and are designed to break up laminar airflow, which further improves heat dissipation efficiency. Finally, the high fin density heatsink is enclosed in a sheet metal duct to direct the entire volume of forced air over the fins, thereby providing the low thermal resistance of 0.04 ºC/W. This low thermal resistance means that for every 10 Watts of power input to the heat-sink mounting plate, the temperature of the heatsink surface will rise 0.4 ºC.

CUSTOMER PRE-DRILLED HOLES FOR YOUR LASER DIDOE ARE AVAILABLE

Custom mounting pre-drilled hole patterns are available. Contact us for details and a quote.

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