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300 Watt Fan and Air-Cooled Heatsink Assembly for Fiber-Coupled Laser Modules

  • 300 W Air Cooled Heat Sink
  • High Power Heatsink for Laser Diodes 300 Watt
  • 300 Watt High Power Heatsink Features

sku / item#: RLS/HS-004
ships: 7 to 10 days

Key Features
  • Low Thermal Resistance: 0.04 ºC/W
  • Suitable for up to 300 Watt Heat Load
  • 6 x Soldered-In Copper Heat Pipes for Maximum Heat Dissipation Efficiency
  • Nickel Plated Mounting Surface for Durability
  • 5 x High CFM Fans for Heat Removal
  • Five Fans, Each 12 VDC, 4.1 Watts
  • Offered by ETE, a Laser Lab Source Marketplace Seller
  • Sold & Supported in North America by: LaserDiodeControl.com, part of the
    Laser Lab Source Marketplace Group

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PRICE $620.00
Key features
  • Low Thermal Resistance: 0.04 ºC/W
  • High Heat Dissipation Capacity: Up to 300 Watts with 12 ºC Temperature Rise
  • 6 x Soldered-In Copper Heat Pipes for Heat Spreading
  • 5 x High CFM Fans for Heat Removal
  • Fan Operating Voltage Range: 4.5 VDC to 13.8 VDC
  • Fan Input Power: 4.1 Watts
  • Rated Current Draw: 350 mA
  • Fan Noise: < 45 dBA
  • Fan Rated Voltage: 12 VDC Input
  • Dimensions (L x W x H): 215 mm x 343.6 mm x 97 mm
  • See datasheet for additional specifications

Product Overview:

High Efficiency Laser Diode Heatpipe-Heatsink-Fan Assembly

The HS-004 is a high quality and versatile integrated heat sink and fan assembl, designed for maximum flexibility across a wide range of applications in your laser diode test lab and prototype shop. The mounting plate is nickel-plated for durability and improved heat conduction. Heat pipes are soldered into the nickel-plated mounting plate to minimize thermal spreading resistance, distribute the heat across the heatsink, and minimize efficiency-robbing thermal hot spots.

The HS-004 is a very affordable solution for a wide range of situations where a fully integrated thermoelectric cooled mount is over-budget. The HS-004 is perfect when high amounts of heat must be conducted away from the test device, but when precision temperature control of the device is not required. The HS-004 provides laser heat dissipation capacity of 300 watts with 12 ºC temperature rise (12 ºC without TECs, 0 ºC rise with optimized TECs).

The HS-004 heatsink is ideal for a wide variety of fiber-coupled laser diode packages and modules, IGBTs and high-heat test loads. It comes with a high quality terminal block for fan wiring. The five high power fans are hidden inside of the air duct, reducing the noise significantly.

Low Thermal Resistance for High Heat-Flux Diode Laser Devices

Heat pipes are used in the HS-008 to maximize conduction of heat from the load to the heat sink and improve overall efficiency by reducing local hot-spots on the mounting plate. The heat sink fins are forged in place and are designed to break up laminar airflow, which further improves heat dissipation efficiency. Finally, the high fin-density heatsink is enclosed in a sheet metal duct to direct the entire volume of forced air over the fins, thereby providing the low thermal resistance of 0.04 ºC/W. This low thermal resistance means that for every 10 Watts of power input to the heat-sink mounting plate, the temperature of the heatsink surface will rise 0.4 ºC.

Customizable Options for Maximum Versatility and Ease-of-Use

All heatsink modules can be ordered with an optional IP68 fan for operating in harsh dust and liquid environments. Also, custom mounting pre-drilled hole patterns are available from the manufacturer. Contact us for details and a quote.

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