275 Watt High Power Laser Diode Heat Sink; Water Cooled Base Plate

Product Overview:

275 Watt Laser Diode Mount & Heat Sink Overview

The LDM-275W high power laser diode heat sink and mounting module is a high-performance mounting solution designed for fiber coupled and free-space laser diodes. It incorporates a water-cooled base plate design which removes waste heat and stabilizes the temperature or your laser. The heat from the laser diode transfers down through the mounting plate to the water cooled heatsink at the base of the cooling block.

The heat emitting from the laser diode is conducted down through the laser mounting plate through a low thermal impedance plate surface. Copper channel pipes located in the base dissipate the heat from the base of the block into the water for removal. The LDM-275W offers a low thermal impedance of < 0.01 K/W mounting surface for the laser being tested. The thermal performance of a passively cooled heat sink is highly dependent on the thermal impedance, or resistance. This measurement is defined in units of degrees Celsius per watt of heat°C/W. The thermal resistance allows the user to determine the amount of temperature rise that the laser diode will experience for each watt of thermal energy that is emitted by the device under test. The dual fans in the base greatly improve the thermal performance of the heat sink and allow the user to set the laser temperature to a set-point which is equivalent to the lab ambient temperature. Careful machining of the mounting plate surface finish and surface flatness are also crucial to the heat sink performance.