Home > TEC Controllers > Analog Technologies > RLS/TEC14M5V3R5AS
$31.90 sku / item#: RLS/TEC14M5V3R5AS ships: Request a Quote for Current Ship Date
Key Features
- 17.5W Board-Level TEC Controller
- 0.001ºC Temperature Stability
- Super-Compact, Fully Molded
- Programmable TEC Current and Voltage Limits
- Customizable Temperature Control Range
- Offered by Analog Technologies, a Laser Lab Source Marketplace Seller
- Please contact Analog Technologies for further assistance
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MODEL | RLS/TEC14M5V3R5AS |
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PRICE | $31.90 |
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Product Overview:
Board-Level Micro TEC Controller
The TEC14M5V3R5AS is an ultra compact, low profile, and fully molded controller designed for driving TECs (Thermo-Electric Coolers) with high electrical and mechanical reliability. Temperature stability of up to 0.0002ºC can be achieved.
In order to maximize electrical and thermal efficiency, the output voltage of the driver is approximately 0.2V less than the input voltage. This feature allows the designer to tailor the system to the exact TEC specifications, and can deliver operational efficiency of up to 90%.
Maximum Versatility in Real-World Environments
The default temperature sensor and control range is 15ºC to 35ºC, but can be modified by selecting the external sensor resistor network values. The design engineer can custom-tailor the temperature detection range for maximum stability and sensitivity. Separate analog inputs on the chip control the TEC current and voltage limits, in order to protect the TEC in use.
A special input-output status pin serves two functions: if the pin is actively pulled low, the controller is shut down; if the voltage output is read, it provides an indication of whether the actual TEC temperature is below- or equal to the setpoint temperature.
Super-Compact Board-Mounted Chip
The TEC controller is super compact, at 14.0mm square and 2.2mm thick. The controller us fully molded for thermal and mechanical stability and durability. A thermal pad on the bottom of the chip can be thermally shorted to the PCB for additional heat-sink capacity.
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