Advanced Thermal Design Dissipates up to 110 Watts of Heat; High Performance LASER DIODE Mount & Heat Sink Assembly

Product Overview:

Heatsink and Fan Assembly For Conduction-Cooled Laser Diodes

The HS-011 is a versatile, highly reliable laser diode heatsink and fan assembly designed for maximum flexibility across a wide range of applications in your lab. The HS-011 is designed for high power laser diode bars and modules which require high amounts of heat to be conducted away from the laser, but highly precise temperature control of the device is not required. The HS-011 provides laser heat dissipation capacity of 110 watts. This heatsink is ideal for a wide variety of fiber-coupled laser packages and modules, IGBTs, bars, arrays and high-heat test loads.

Low Thermal Resistance for High Heat-Flux Diode Laser Devices

The heatsink housing is designed to be placed on a flat table. The high fin-density heatsink is enclosed in a sheet metal duct to direct the entire volume of forced air over the fins, thereby providing the low thermal resistance of 0.11 ºC/W (tested with a 2-inch square heat-load attached to the mount plate). This low thermal resistance means that for every 10 Watts of power input to the heat-sink mounting plate, the temperature of the heatsink surface will rise 1.1 ºC.

Customizable Options for Maximum Versatility and Ease-of-Use

All heatsink modules can be ordered with optional IP68 fans for operating in harsh dust and liquid environments. Also, custom mounting pre-drilled hole patterns are available. Contact us for details and a quote.