TEC Cooled High Power Laser Diode Mount & Heat Sink for Laser Diodes with 5W to 45W Optical Output Power
$710.00 sku / item#: LDM-50W ships: 2 weeks
- Dissipates up to 50 Watts of Heat
- Mounting Plate Footprint and Anode/Cathode Leads are Pre-Configured for your Laser Diode
- Integrated Peltier Cooler and 10 kOhm Thermistor
- Standard Configurations for Fiber Coupled Modules from nLight, Lumentum, IPG, Lumics, Eagleyard and II-VI
- Offered by OsTech, a Laser Lab Source Marketplace Seller
Sold & Supported in North America by: LaserDiodeControl.com, part of the Laser Lab Source Marketplace Group
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Customers Also Considered:
|INTEGRATED PELTIER COOLER and thermistor specifications|
|Cooling Capacity @ 25°C Ambient (room) Temperature|
|Fan for Waste Heat Removal (in heat sink base)|
50 Watt Laser Diode Mount & Heat Sink Overview
The LDM-50W is an actively cooled heat sink which utilizes a Peltier TEC element embedded beneath the laser mounting plate as well as a fan in the base of the cooling block. The heat from the laser diode is pumped through the TEC to the heatsink at the base of the cooling block. The fan located in the base dissipates the heat from the base of the cooling block.
These Peltier / TEC-cooled mounts provide high performance heat removal and temperature stabilization for the pump laser diode. Standard mounting plates are available for most fiber coupled package styles, and custom plates are available.
Mount & Heatsink Features
The heat sink and mounting modules offer a temperature control range of +10 °C to 45 °C and can dissipate up to 52 watts of waste heat at a lab temperature of 25 °C.
The mount includes a 15-pin D-Sub connector, wired for the built-in TEC, temperature sensor, and the fan in the base. The connector also includes pre-wired Anode and Cathode leads for the laser package.
Mount & Heatsink Thermal Conductivity
The LDM-50W offers a low thermal impedance of < 0.06 K/W.
The surface of the mounting plate is machined with micron level surface flatness and finish tolerances. These units ship with a graphite thermal mounting pad which can be placed under the laser to increase thermal conductivity to the mounting plate. The graphite pad is slightly flexible so that small particulates or dust don't inhibit the thermal conductivity path. These features combine to provide a very low thermal resistance between the laser and the TEC controlled mounting plate.
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