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200 Watt thermoelectric cold plate module

  • 200 Watt Laser diode heat sink
  • 200 Watt Laser diode heat sink Dimensions
  • 200 Watt Laser diode heat sink Performance

$1100.00  
sku / item#: RLS/OCP-200
ships: 2 Weeks ARO

Key Features
  • Flexible TEC-Based High Power Laser Diode Heat Sink
  • 200 Watt Heat Load Capacity @ 25ºC Ambient
  • 2x Prewired TEC Sets
  • 2x High CFM Fans
  • Offered by: ETE, a Laser Lab Source Marketplace Seller
  • Sold & Supported in North America by: LaserDiodeControl.com, part of the
    Laser Lab Source Marketplace Group

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MODEL RLS/OCP-200
PRICE $1100.00
General SPECIFICATIONS
  • Mounting Plates Available: LIMO, QPC, nLIGHT, DILAS, Lasertel, Jenoptik, JDSU, COHERENT, NG-CEO, Quantel (model specific)
  • Thermal Resistance, TEC to Ambient: 0.06ºC
  • Typical Temperature Uniformity: <0.5 ºC Across Mounting Plate
  • TEC Max Rating: 150ºC
  • Heat Load Maximum: 200 Watts
  • Cooling Plate Material: Nickel Plated Copper
  • TEC Ratings (max): 7.5 Amps, 24 Volts Per TEC Set
  • Fan Rated Voltage: 12 VDC
  • Fan Input Power: 9.9 W
  • Fan Noise Level: 47 dBa
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  • Refer to Datasheet for additional specifications

Product Overview:

High Power thermoelectric cold plate module

The OCP-200 is a high quality and versatile integrated thermoelectric cold plate module, designed for maximum flexibility across a wide range of applications in your laser diode test lab, prototype shop, and for OEM applications.

The OCP-200 is an affordable solution for a wide range of situations where a fully integrated thermoelectric cooled mount is needed for precision temperature control. The OCP-200 will dissipate up to 200 Watts with 0 ºC temperature rise. The mounting plate is nickel-plated copper for improved heat conduction and durability.

The OCP-200 has standard mounting patterns for the many of the most popular fiber coupled high power laser diodes; custom mounting hole pattern is available upon request.

The OCP-200 comes with a high quality terminal block for fan wiring. The two high power fans are hidden inside the air duct, reducing the noise significantly.

Low Thermal Resistance for High Heat-Flux Diode Laser Devices

The OCP-200 features two sets of sealed high quality thermoelectric coolers, pre-wired, and sandwiched between the mounting plate and the heatsink base plate.

The heatsink fins are forged in place and are designed to break up laminar airflow, which further improves heat dissipation efficiency. Finally, the high fin-density heatsink is enclosed in a sheet metal duct to direct the entire volume of forced air over the fins, thereby reducing the low thermal resistance.

Customizable Options for Maximum Versatility and Ease-of-Use

The OCP-200 can be ordered with custom mounting hole configurations. All heatsink modules can be ordered with an optional IP68 fan for operating in harsh dust and liquid environments. Also, custom mounting pre-drilled hole patterns are available from the manufacturer. Contact us for details and a quote.

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